Hi NXP,
I am using SBC Chip(MFS2613AMDA6) for Some Failsafe action feature in my project.
I have gone through the datasheet. It is mentioned that FS0B Pin will be low at initial power on condition and it will be released to high, once release sequence command send through SPI.
But still I need some more clarity in FS0B internal circuit, since it is released to high before writing release sequence command through SPI.
Please explain when this MOSFET will be switched on to pull down the FS0B pin state to low.

Thanks for Support.