Content originally posted in LPCWare by NXP_Support on Thu Dec 03 10:25:46 MST 2015NXP announced a new Cloud Connectivity Kit in collaboration with Zentri this week:
Eindhoven, Netherlands, December 2, 2015 – NXP Semiconductors N.V. (NASDAQ: NXPI) today unveiled the LPC43S67-A70CM Cloud Connectivity Kit designed to significantly reduce time-to-market for deploying IoT products. The kit helps designers bridge the gap between un-connected embedded products to cloud-connected products without the need for deep expertise in security, Wi-Fi stacks, device commissioning, and cloud service APIs. NXP collaborated with ecosystem partner, Zentri, known for creating a single platform stack that helps companies build connected products for the IoT market, to combine the NXP LPC43S67 microcontroller, A7001CM secure element and NTAG I2C NFC, a Murata SN8000 802.11b/g/n module, with the Zentri Secure Connected Product Platform. The kit is designed to simplify the effort and reduce the time needed to create and deploy secure, connected products such as vending machines, personal health devices and interactive displays, industrial products used for factory automation, industrial gateways and diagnostic equipment, as well as consumer products used in the home, such as washing machines and thermostats. The LPC43S67-A70CM Cloud Connectivity Kit jumpstarts all three key aspects of developing an IoT product: security and connectivity of the physical device, including secure cloud-based device management for provisioning and remote management developing applications for end users and connected users, and protocol-agnostic cloud connectivity to support the connected functionality and services.
Full press release here: http://www.nxp.com/news/press-releases/2015/12/new-nxp-and-zentri-cloud-connectivity-kit-reduces-tim...
See more about the Kit here: http://www.nxp.com/lpc43s67-a70cm-solution
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