Hi, I'm looking for microcontroller in die form which is direct bonding, flip chip with bump and has total thickness not over than 50um and die dimension 2x2mm (could be less or more), Could anyone how may concern please share your information to us.
Hello,
Please take a look to the MKL02Z32CAF4, which have
0.4 mm pitch; 1.94 mm x 1.99 mm x 0.6 mm body.
This is one of our tiniest MCUs.
Hope this helps,
Regards,
Aldo.
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