PCA9450 || Thermal details

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PCA9450 || Thermal details

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JyotiVaishnav
Contributor II

Hello Team, 

Can you please help us with the below details if you have 

This details are required to do a thermal analysis of the product.  
1. Storage Temperature 
2. Case Temperature
3. Junction to Base Temperature( RθJB)
4. Junction to Case Temperature( RθJC)
 
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frank_lorenz
NXP Employee
NXP Employee

@guoweisun  CTM is as well asking for  :

Rth(J-B) = thermal resistance junction to board

Do you have this information?

Thx,

Frank

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frank_lorenz
NXP Employee
NXP Employee

Hello @guoweisun 

I got the same question from a CTM, in the table above are some side notes - can you share them with us?

Or is it possible to share the document with the CTM?

Thx,

Frank

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guoweisun
NXP TechSupport
NXP TechSupport

guoweisun_0-1689060997904.png

guoweisun_1-1689061052149.pngguoweisun_2-1689061112514.png

Max Tj to 150C.

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guoweisun
NXP TechSupport
NXP TechSupport

Please help and fill below info:

1: company name/location

2:project schedule

3: volume/annual

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JyotiVaishnav
Contributor II

Hello @guoweisun 

Hope you are Well !

Please find the below details FYR. 

1: Company name/location - VVDN Technologies / Ahmedabad 

2: Project schedule - The project schedule will be as follows after it gets started: EVT - 13 weeks, DVT - 25 weeks, PVT - 29 weeks; this project is not yet started but will begin in the first week of August. --- project kickoff will happen in the 1st week of august

3: Volume/annual - In discussion with the customer

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