Hi all
I'd like to get your thoughts on my problem.
My customer built custom boards that is over 10 with i.MX6Dual and had some issues.
The issues are as below.
These boards can boot from serial boot.
When they test a platform_SDK and DDR Stress Test, it has no error.
The concern is that the board isn't satisfied with the location of the bulk capacitor recommedation.
From the above results, I guess that it is caused by lack of meeting some recommendation.
So if they satisfy some recommendation, the issues will be disappeared.
What do you think about it ?
Please tell me your opinion.
Ko-hey
Solved! Go to Solution.
Hi ko-hey
you are right, not following bulk capacitor placement recommedations
may lead to described issues.
Recommended to place the various sized CAPs, where as the larger sized bulk
CAPs are further out and the smaller high freq CAPs (0.22 uF) are closest to the
power balls as possible. To satisfy stability requirements over process and
temperature conditions one needs to follow EB814:
http://cache.freescale.com/files/32bit/doc/eng_bulletin/EB814.pdf
Best regards
igor
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Hi ko-hey
you are right, not following bulk capacitor placement recommedations
may lead to described issues.
Recommended to place the various sized CAPs, where as the larger sized bulk
CAPs are further out and the smaller high freq CAPs (0.22 uF) are closest to the
power balls as possible. To satisfy stability requirements over process and
temperature conditions one needs to follow EB814:
http://cache.freescale.com/files/32bit/doc/eng_bulletin/EB814.pdf
Best regards
igor
-----------------------------------------------------------------------------------------------------------------------
Note: If this post answers your question, please click the Correct Answer button. Thank you!
-----------------------------------------------------------------------------------------------------------------------
Hi Igor
I understand logically but I can't proof it.
How can I proof it ?
Ko-hey
Hi Ko-hey
one can hand solder capacitors directly under center of chip.
Best regards
igor
Hi Igor
Thanks.
Ko-hey
Hi Igor
Let me confirm one thing.
Could you tell me the measurement conditions of equipment ?
Ko-hey
Hi Ko-hey
measurement conditions are common: measure with multimeter
as close to processor pads as possible.
Best regards
igor
Hi Igor
I'm sorry in insufficient explanation.
I want to know a recommend equipment condition such as sampling freq of oscilloscope and type of probe.
What conditions do you measure the ripple on voltage rail in freescale ?
Ko-hey
Hi Ko-hey
I do not have such data, sorry. But one can use any oscilloscope,
there are no special requirements for it.
Best regards
igor
Hi Igor
OK! Thanks!
Ko-hey