MMZ09332BT1 pin 4,5

キャンセル
次の結果を表示 
表示  限定  | 次の代わりに検索 
もしかして: 

MMZ09332BT1 pin 4,5

977件の閲覧回数
prof3232
Contributor I

Hello.

We want to use MMZ09332BT1 in the 400 MHz band.

We made a PCB of our transmitter with an output amplifier MMZ09332BT1 with following the example of datasheet for the band of 400-500 MHz. But the output of the amplifier breaks after a short worktime . Vcc1=Vcc2+4,5V. Vbias=3,7V. 

We use FR4 instead Rogers RO4350B.

What is the cause of failure?

Could you send a working evaluation board for the band of 400-500 MHz?

Are pins 4, 5 ground or not?

Aleksandr Bezgin

0 件の賞賛
返信
2 返答(返信)

761件の閲覧回数
LPP
NXP Employee
NXP Employee

>We use FR4 instead Rogers RO4350B.

FR4 has different dielectric coefficient and thus the microstripline width should be different to obtain the same impedance as for Rogers material. Though, in the case of 400MHz, it is not  critical.

0 件の賞賛
返信

761件の閲覧回数
LPP
NXP Employee
NXP Employee

>But the output of the amplifier breaks after a short worktime
Does the operation resume after power turn off or is it a fatal fail?

It looks like a thermal issue.

The PCB layout should provide thermal pad with thermal vias. The device must be soldered to thermal pad. Vias with 1/2 or more Cu plating. Bottom layer should have 1..2 oz Cu plating.

Let me provide some estimations for the test board from NXP. It has 10mils thickness, 1/1 oz copper foil and ~0.7oz is added by plating, x14 thermal vias, 8mils diameter, 0.7 oz plating.

 Second stage junction-to-case thermal resistance 26'C/W
 Estimated thermal resistance of vias 1/14 * 36.1'C/W  = 2.6'C/W.
 Estimated 1.6x1.6 mm pad to ambient thermal resistance of 1.7 oz Cu plate 28'C/W.
-------------------------------------------------------------------
 Estimated junction to ambient thermal resistance 26+2.6+28 = 56.6'C/W
 Estimated junction temperature rise @Po=34dB: dT = 2W*56.6'C/W = 113'C
 So, the board can be used without additional heat sink up to Ta[max] = 175'C[Tj max] - 113'C[dT] = 62'C

The result would be different if a design has different thermal via parameters, different Cu layer and board thickness.
The last item is the board-to-ambient thermal resistance. It can be minimized down to 3..6'C/W if the board is attached to a heat sink or thick metal plate.

>Could you send a working evaluation board

The most recommended procedure to obtain test board (fully assembled or not populated PCB) would be contact our authorized distributor (Richardson RFPD, mail: rfpdsales@arrow.com). Please discuss your needs with their FAE or Sales Person and ask them for placing order for this test fixture board at NXP.

You might have problem to get the board in Russia. My suggestion is to contact local distributor Simmetron. They have dedicated persons to work with NXP.
 
Please, if you need further board bring up assistance then create a ticket to NXP support.
Have a great day,
Pavel

-----------------------------------------------------------------------------------------------------------------------
Note: If this post answers your question, please click the Correct Answer button. Thank you!
-----------------------------------------------------------------------------------------------------------------------

0 件の賞賛
返信