please share the PCB land pattern and 3D model

[yerriswamy_c]

Hi Team,

Can some one help me with PCB layout and 3D model for MPN: MC68302EH16C 

Thanks

[Ben]

CY, I might get the full information you need, but I am confused from the DS.

Is the chip 132 pads type or 256?

Are you using the bare PQFP package or the chip on a carrier adapter?

Please answer (and if you have the chip picture) and I might get for you the the PCB footprint and maybe 3D too

Ben

[Hui_Ma]

Hi CY,

There is an application note AN4388 about QFP package PCB design.

Wish it helps.

Have a great day,
Mike

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[Ben]

Mike, thank you for sharing this AN.

Ben

[Ben]

OK, I found NXP document that meet this chip mechanics : https://www.nxp.com/docs/en/package-information/98ASS23451W.pdf . Is it the data you are looking for?

[yerriswamy_c]

Actually I too got the same pdf from NXP website but it is not giving enough information on land pattern.

[Ben]

Hello CY

In the chip ordering information there are only RC/FC/PV suffix. What is the EH?

[yerriswamy_c]

Hi Ben

I am not sure what is EH in MPN. This one we got it from our customer.