Dear NXP,
Our Car TPMS project uses NXP products, a total of 4 ICs，FXTH87EH11DT1 (tire pressure sensor, HQFN24 package), QN9020 / EY (Bluetooth LE, HVQFN48 package), QN9021 / EY (Bluetooth LE, HVQFN32 package), NCK2910AHN (RF receiver, HVQFN32 package).
For the packaging of related chips, our chip has encountered soldering problems, that is, poor solder contact of the chip. As a result, some chips cannot work, or only work for a period of time. We need to seek your support to improve our placement process.
For the four chip packages mentioned above, does NXP have a placement process description document?
Looking forward to your reply.
Thank you.
Best Regards
Owen
