I.mx6q flash failed

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I.mx6q flash failed

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浩卢
Contributor III

I have flashed i.mx6q with MFGTOOL and it  stoped at jump to os image.But after heated to the board,I can flashed succeed.I have tested 10 i.mx6q boards like this.

Someone can hlep me please?

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jian_jiang
NXP Employee
NXP Employee

I have met the same problem twice.

My PC were down at the same time the board crashed when using the MFG_TOOL.

When the PC and board were restart, the second trail would be success.

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sunnyvan
Contributor II

I also encountered the same problem.

About the MFGTool and boot issue on IMX6

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浩卢
Contributor III

By adjust the strength of ddr ,I also can't flash I.MX6.

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sunnyvan
Contributor II

Hi,

Has the problem been solved?

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浩卢
Contributor III

sorry. I have‘t solved yet.

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Rita_Wang
NXP TechSupport
NXP TechSupport

Hi

我这里帮你确认了一下,你这里应该是炉温不够引起的,或者是DDR3颗粒有氧化的可能。建议你换内存颗粒试一下。或者重新焊接一下DDR3颗粒。

或者你也可以用BGA焊台,重新给DDR3再次加热。

希望如上可以对你有帮助。

Have a nice day

Dan

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浩卢
Contributor III

Dan Wang 你好

问题已经解决了,我还疑跟板材有一定的关系,这次用的是IT-180。

我们可以分析一下问题,10块样板,在加热DDR的情况下,都能烧写成功,并且可以长时间稳定的运行,那么我认为硬件上本身不存在什么设计缺陷;

MFG_TOOLS的烧写原理:通过USB下载linux的uboot,kernel,filesystem来启动一个简单的linux系统,在linux系统下,通过dd命令来进行烧写,在不加热的情况下,经过分析log文件,能够确定uboot已经load下去了,但是没有能正常启动,那么能够证明,烧写用的uboot和我自己编译的uboot,肯定是不一样的,所以我参考自己编译的uboot的flash.S文件,修改了烧写用的uboot的falsh.S的参数,后来就可以正常烧写了。

问题总结,从我的情况看来,我认为FSL在烧写使用的uboot的上,存在一定的不合理性,既然自己编译使用的uboot的能够正常启动板子,那么,烧写使用的uboot为什么要设计不一样的参数,目的又是什么?

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sunnyvan
Contributor II

浩卢:

您好!我也是同样的问题,现在还没有解决,你是在更换了板材后才烧写成功,还是不更换板材,只修改head.s就可以烧写成功呢?修改的head.s是涉及到哪些参数呢,只需要和自己的uboot一样就可以了么?

期待你的回复!谢谢!

在 2016年4月12日,14:22,浩卢 <admin@community.freescale.com> 写道:

NXP Community

I.mx6q flash failed

reply from 浩卢 in i.MX Community - View the full discussion

Dan Wang 你好

问题已经解决了,我还疑跟板材有一定的关系,这次用的是IT-180。

我们可以分析一下问题,10块样板,在加热DDR的情况下,都能烧写成功,并且可以长时间稳定的运行,那么我认为硬件上本身不存在什么设计缺陷;

MFG_TOOLS的烧写原理:通过USB下载linux的uboot,kernel,filesystem来启动一个简单的linux系统,在linux系统下,通过dd命令来进行烧写,在不加热的情况下,经过分析log文件,能够确定uboot已经load下去了,但是没有能正常启动,那么能够证明,烧写用的uboot和我自己编译的uboot,肯定是不一样的,所以我参考自己编译的uboot的flash.S文件,修改了烧写用的uboot的falsh.S的参数,后来就可以正常烧写了。

问题总结,从我的情况看来,我认为FSL在烧写使用的uboot的上,存在一定的不合理性,既然自己编译使用的uboot的能够正常启动板子,那么,烧写使用的uboot为什么要设计不一样的参数,目的又是什么?

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浩卢
Contributor III

MXC_DCD_ITEM(44, MMDC_P0_BASE_ADDR + 0x83c, 0x4302030B)  //0x4433033F

MXC_DCD_ITEM(45, MMDC_P0_BASE_ADDR + 0x840, 0x0275026A)  //0x032C031D

MXC_DCD_ITEM(46, MMDC_P1_BASE_ADDR + 0x83c, 0x4302031A)  //0x43200332

MXC_DCD_ITEM(47, MMDC_P1_BASE_ADDR + 0x840, 0x027B0249)  //0x031A026A

MXC_DCD_ITEM(48, MMDC_P0_BASE_ADDR + 0x848, 0x3F343534)  //0x4D464746

MXC_DCD_ITEM(49, MMDC_P1_BASE_ADDR + 0x848, 0x3A373345)  //0x47453F4D

MXC_DCD_ITEM(50, MMDC_P0_BASE_ADDR + 0x850, 0x31424732)  //0x3E434440

MXC_DCD_ITEM(51, MMDC_P1_BASE_ADDR + 0x850, 0x48334736)  //0x47384839

尝试修改一下这些参数。

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sunnyvan
Contributor II

这些参数是怎么得到的?是根据你的board校准的还是其他方式?

在 2016年4月13日,11:31,浩卢 <admin@community.freescale.com> 写道:

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I.mx6q flash failed

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MXC_DCD_ITEM(44, MMDC_P0_BASE_ADDR + 0x83c, 0x4302030B) //0x4433033F

MXC_DCD_ITEM(45, MMDC_P0_BASE_ADDR + 0x840, 0x0275026A) //0x032C031D

MXC_DCD_ITEM(46, MMDC_P1_BASE_ADDR + 0x83c, 0x4302031A) //0x43200332

MXC_DCD_ITEM(47, MMDC_P1_BASE_ADDR + 0x840, 0x027B0249) //0x031A026A

MXC_DCD_ITEM(48, MMDC_P0_BASE_ADDR + 0x848, 0x3F343534) //0x4D464746

MXC_DCD_ITEM(49, MMDC_P1_BASE_ADDR + 0x848, 0x3A373345) //0x47453F4D

MXC_DCD_ITEM(50, MMDC_P0_BASE_ADDR + 0x850, 0x31424732) //0x3E434440

MXC_DCD_ITEM(51, MMDC_P1_BASE_ADDR + 0x850, 0x48334736) //0x47384839

尝试修改一下这些参数。

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Rita_Wang
NXP TechSupport
NXP TechSupport

Hi

In your design have you changed the DDR, or do any changes? Or use the default one in our reference board?

Have a nice day

Dan

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Rita_Wang
NXP TechSupport
NXP TechSupport

Hello,

Here if you do not heated the board, it stopped at jump to os image?

Best Regards

Dan

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Rita_Wang
NXP TechSupport
NXP TechSupport

Hi ,

Are all your board like this? Here you design your board yourself, are you refer to the design of our reference board?

Have a nice day

Best Regards

Dan

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