Would it be possible to confirm that the following date/lot codes are Rev1.1 silicon?: (the text below is from the label on the shrink wrapped foil enclosing the waffle pack)
Waffle Pack #1:
(1P) MPN: PVF61NN151CMK50
(1T) LOT: WD000C7300
(9D) DTE: 1309
(Q) QTY: 5
Diffused in: US
Assem in: TAIWAN(TI)
MS Level: 3, Hours: 168
Sealed: 12Jun13, Temp: 260C
PbFree=Y, RoHS=Y
2nd lvl Intct = e1
(X) LPN: RU00009FAM
Waffle Pack #2:
(1P) MPN: PVF61NS151CMK50
(1T) LOT: WD000C7900
(9D) DTE: 1309
(Q) QTY: 5
Diffused in: US
Assem in: TAIWAN(TI)
MS Level: 3, Hours: 168
Sealed: 12Jun13, Temp: 260C
PbFree=Y, RoHS=Y
2nd lvl Intct = e1
(X) LPN: RU00009FAO
I could have opended the package and inspected the part marking on the chip top but I'd prefer not to disturb the humidity controlled bag since the parts may not be soldered for several weeks.
Pictures of the labels are attached. Thanks, Chris
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Since they were packed in mid June, I'd be very confident they are 1.1 silicon. Once you open them, they'll be marked with 1N02G
Since they were packed in mid June, I'd be very confident they are 1.1 silicon. Once you open them, they'll be marked with 1N02G