Hi,
I am a grad student working at Florida Institute of Cybersecurity at University of Florida.
In one of the documents (https://www.nxp.com/docs/en/application-note/AN11761.pdf) published by NXP,
something about removing flip-chip die from an interposer layer is mentioned.
As part of an experiment, I am having to remove a flip-chip die from an interposer layer. Can you please suggest a method of doing that? Or point to a resource that might be helpful?
