I found attached PCB stackup file for SDP board and I checked the stackup of LAY-27392_C.brd. I got to know they are different.
In attached file, impedance of differential 100 ohm on top and bottom layer is controlled 3.7/9/3.7, but controlled 3.7/5.3/3.7 in Lay-27392.brd. Differential 90 ohm is also different. I think LAY-27392 seems to comply with the Hardware Development Guide document (IMX6DQ6SDLHDG).
In addition, the thickness information is also different. LAY-27392 is 41.74 mil (1.06 mm) as below picture, but actual measurement value is 62 mil (1.57mm). I don't know what stack-up I refer.
I want the exact data of LAY-27392 for impedance control.