Hi!
I see a difference in the footprint recommended in the datasheet and in the HW Guide related to the pad size of the iMX8 MINI.
A 0.3mm BGA pad is recommended in the datasheet.
However in the HW guide suggest you that is not necessary and HDI to fanout these BGA with 3mils trace/distance
The BGA pads for achieving the 3.2mils is 0,255mm pad
Moreover in the iMX8 MINI evaluation board the pad seems to be 0,255 too
Someone has tested to assambly these boards with 0,255mm BGA pad in order to fanout the second round and avoiding HDI dessign?
Thanks!
