Have a great day,
Please see section 22.2 “Nomenclature of Parts Fully Addressed by this Document” in the data sheet
https://www.nxp.com/docs/en/data-sheet/MPC8533EEC.pdf
Using table Table Device Nomenclature you can easily see the differences. Notice for migration from VT device to VJ device there is PCN “Device Migration from Leaded Wafer Bumps to Lead-Free Wafer Bumps”
https://www.nxp.com/docs/en/product-change-notice/PCN16365.htm
For each MPC8533 device you can get details on the nxp site. For example for the MPC8533EVJANGA see page
https://www.nxp.com/part/MPC8533EVJANGA
Because these devices have different revision you may need to check the MPC8533 errata, some issues have been fixed on new revision. Unfortunately it is not public document (requires for NDA).
-------------------------------------------------------------------------------
Note:
- If this post answers your question, please click the "Mark Correct" button. Thank you!
- We are following threads for 7 weeks after the last post, later replies are ignored
Please open a new thread and refer to the closed one, if you have a related question at a later point in time.
-------------------------------------------------------------------------------
