Please, refer to these documents:
http://cache.freescale.com/files/32bit/doc/package_info/PBGAPRES.pdf
http://cache.freescale.com/files/microcontrollers/doc/app_note/AN3300.pdf
http://www.freescale.com/files/product/doc/ENV_PBFREEOV2.pdf
Note. Package Peak Temperature (PPT) profile is for determination of components Moisture Sensitivity Level (MSL) and the parts’ processability per J-STD-020. PPT is the minimum temperature used for MSL qualification. Actual reflow temperature should not exceed this value. Optimal temperature profile depends on the solder paste and flux used.
The actual reflow profile to be used for any PCB should be available from the paste supplier as a recommended profile. Use care when looking at the paste reflow profiles supplied by paste vendors. Adjustments will have to be made when using a paste-flux for a set of conditions it is not primarily targeted for.
Have a great day,
Pavel
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