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MKE02Z64VFM4: Package Marking

Question asked by Colin Campbell on Jul 22, 2019
Latest reply on Jul 25, 2019 by Kerry Zhou



We are implementing an MKE02Z64VFM4 CPU based design and wanted to confirm the correct package marking for this device including part number, die version, date code and fab facility. Although we can find the related HVQFN32 footprint information, we are unable to find a package marking specification on the NXP site for this device.


Thanks for the guidance - CC