Content originally posted in LPCWare by bavarian on Fri Oct 30 04:32:14 MST 2015
Hi,
it is indeed possible to drive the power consumption of the LPC4300 into the region of 200 - 300mA. The power consumption of the internal blocks, if operated on highest performance level, could reach 180mA (excluding the high speed ADC for the moment). Depending on what you connected to the I/O pins you can add the rest.
But of course it is not "normal" to run on such a high performance 100% of the time. If you have such a use case, then I would recommend to use a heatsink.
After startup all peripheral blocks are enabled, so you should disable all the blocks you don't need in your application.
However, your problem seems to be more complicated than this, when you see it working fine on the Link2 board (LPC4320) but not on your own PCB (LPC4370).
I can't explain the difference in power consumption with the differences between the LPC4320 and the LPC4370. But please take care that some of the more power hungry peripherals like EMC, USB1 or the high speed ADC are switched off. Consuming power, getting warm, consuming more power, getting hot etc is a viscous circle in silicon technology, so somehow you need to manage that the dissipated heat from the silicon gets away from it, through the PCB connections and over the package surface.
Try to reduce the speed for the processor and the peripheral blocks as much as possible. For a correct USB functionality you can't go down a lot with VDD.
Simpler than the schematic for the Link2 is not possible, if you leave out some mechanical parts and the line drivers for the SGPIO, then you have the minimum number of components/connections.
Regards,
NXP Support Team.