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'Multi-core Processor Technology’ will be the key in the development of next generation of advanced computing devices. With major silicon vendor Freescale bringing multi-core application processors for the mainstream embedded devices, there is  need to have the multi-core processing support in the embedded operating systems. Windows Embedded Compact 7(WEC7) will enhance the performance of ARM based multi-core platforms with the addition of Symmetric Multi-Processing (SMP) support. iWave systems has done a SMP support verification on its Freescale’s i.MX6 Quad core processor running WEC7 platform. Symmetric Multi-Processing (SMP) support in WEC7: The most important update in the Windows Embedded Compact 7 is the support for Symmetric Multi-Processing (SMP) which takes the full advantage of multi-core systems providing a performance boost when the multithreaded applications are being used. The multi-core processor platforms such as Freescale’s i.MX6Q which has 4 identical CPU cores, can effectively take advantage of SMP support in WEC7. SMP enabled kernel can use several CPU cores simultaneously and distribute the execution of different processes and threads to them. The number of available cores can be determined by SMP API from the application – the processing and assignment of a thread to a specially selected core is also possible. Read More.. Windows Embedded Compact7 on i.MX6 RainboW-G15D Development Board: iWave Systems, profoundly known for its genuine embedded solution offerings spanning from SOMs to fully integrated systems, offers Windows Embedded Compact 7 (WEC7) reference BSP for iWave’s i.MX6 platform named RainboW G15D besides the existing Linux & Android BSP versions. All the latest features that WEC7 offers such as Silverlight 3.0, MPEG-4 HD, Expression Blend, Active Sync and also Adobe Flash10.1 are made available. About i.MX6 Qseven Development Board: The Development Platform incorporates Qseven compatible i.MX6x SOM which is based on Freescale's iMX 6 Series 1.2GHz multimedia focused processor and Generic Q7 compatible Evaluation Board. This platform can be used for quick prototyping of any high end applications in verticals like Automotive, Industrial & Medical. Being a nano ITX form factor with 120mmx120mm size, the board is highly packed with all necessary on-board connectors to validate complete iMX6 CPU features. About iWave Systems: iWave has been an innovator in the development of “Highly integrated, high-performance, low-power and low-cost i.MX6/i.MX50/i.MX53/i.MX51/i.MX27 SOMs”. iWave helps its customers reduce their time-to-market and development effort with its products ranging from System-On-Module to complete systems. The i.MX6 Pico ITX SBC is brought out by iWave in a record time of just 5 weeks. Furthermore, iWave’s i.MX6/i.MX50/i.MX53/i.MX51/i.MX27 SOMs have been engineered to meet the industry demanding requirements like various Embedded Computing Applications in Industrial, Medical & Automotive verticals. iWave provides full product design engineering and manufacturing services around the i.MX SOMs to help customers quickly develop innovative products and solutions. For more details: WEC7 on i.MX6 Rainbow G15D  | iWave Systems email: mktg@iwavesystems.com
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Freescale’s comprehensive home health hub (HHH) reference platform is designed to speed and ease development for emerging telehealth applications using seamless connectivity and data aggregation to provide remote access and improved healthcare management. It provides multiple connectivity options to obtain data from commercially available wired and wireless healthcare devices such as blood pressure monitors, pulse oximeters, weight scales, blood glucose monitors, etc. The HHH reference platform incorporates broad capabilities so that design engineers have flexibility in their next generation remote monitoring designs. In addition to connectivity for collecting data from healthcare devices, the HHH reference platform also provides connectivity to take action with the collected data by sharing it through a remote smart device with a display such as a tablet, PC or smartphone or through the Cloud. This connectivity gives the person being monitored and caregivers (including family, friends and physicians) a way to track and monitor health status as well as provide alerts and medication reminders. Most importantly, this interface delivers a real-time connection to caregivers to bring ease of mind and offers comfort and safety to the person being monitored. Features Automatic reporting of vital sign measurements Cloud connectivity and secure integration into medical vaults Pervasive mobile device access Daily activity alarms, security alarms and passive monitoring of safety sensors for early detection of injury or security risks Anytime consultation with monitoring center, medical staff, family and friends Anytime and intuitive access to trusted health resources Compelling user interface for a remote display  
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Airbus connected factory to shorten Time To Market, Remy’s Martin connected bottle to avoid counterfeit, Schlindler’s elevator smart sensors to improve security, Cisco-IBM connected port in Colombia to enable predictive maintenance, these are some successful examples of B2B IoT creating value and business, and there are many more to come. MACKINSEY ASSESS THAT 70% OF POTENTIAL VALUE ENABLED BY IOT SHOULD COME FROM B2B! McKinsey Global Institute – “The internet of Things: mapping the value beyond the hype” – June 2015 A growing number of companies understand the potential of IoT for B2B markets and its trillions dollars’ revenue expected in 2020 (from 3 to 20 depending on sources and studies). That said, you don’t develop a bluetooth key ring the same way as a sensor designed to monitor temperature in a hot caustic reactor lost in the middle of nowhere and requiring 99,9% availability. While B2C IoT main challenges will remain business application and datamining, B2B brings an additional complexity to the device and its direct environment (gateway, other IoT devices, IT, etc). That is why we make a distinction between the “sexy” IoT focused on B2C and its challenges (marketing, business model, retention, etc.) and what we call the “serious IoT” which is more related to industrial and B2B stakes. This article is the first of a series where I aim to describe the whole process of IoT project development, from a business point of view as well as a technical point of view I will start with this first article by giving what I believe is the best methodology to start a BtoB or Industrial IoT project.   What are the challenges of serious IoT? What are the key success factors to launch a product? What to begin with and which steps to follow? THE FOUR PILARS TO SUCCEED IN AN IoT PROJECT Before I dig into the process to follow, let’s share some key success factors that I’ve identified in all the IoT projects I’ve seen and run: Design thinking As IoT is “hype”, many companies want IoT to launch a project and forget that simple saying: “no pain, no gain”. If there is no pain to be addressed with the project, it will certainly end up in the archive box of the data room. Design thinking allows to have a consumer-centric approach at each stage of the development and ensures your project/product relieves pain, brings a benefit for the customer (even if customer is internal). Master a wide range of technologies MacKinsey assess that system interoperability represent 40% of the potential value of IoT revenue. The “inter” of interoperability means that companies would need partners mastering many different technologies to have all layers/devices work together. In the embedded/IoT world, this can easily exceed 50 technologies (HW architectures, OS, radio & network protocols, frameworks, applications, etc.).  So the success of an IoT project, and more widely of an embedded project, is moving from a technical “silo” expertise to a system approach coupled with technical expertise. Designing the device itself also requires a wide range of expertise and a system approach to optimize the whole system based on business application requirements. Reliable partners (either for technologies or distribution channel) This is often called ‘open innovation’, a term that can freak out CEOs or CTOs. It is simply the fact that you build your project involving partners at each stage to create more value.  As IoT impacts every single bloc of the business model (distribution channel, revenue mode, communication, key activities, key resources, etc.), not a single company can have every related asset internally. So finding the right partners, and sharing value with them, is key to manage and roll-out the project Agile approach This is another “buzz” word. But it is not so obvious for companies not coming from the software industry or coming with a pure embedded software mindset and its 'waterfall approach'. IoT sees many new comers discovering the software challenges, and trying to apply their regular development processes (V cycle for example) to the IoT project. That is the best way to burn it in endless discussions on product scope, spend a lot of money on redeveloping things, and delaying your project launch forever. WHERE AND HOW TO START YOUR IoT PROJECT? Now you’re thinking: “Hmm, interesting, thanks Mr Consultant for this completely un-operational advice. But that doesn’t help me to start”. Don’t you leave now, here is the practical part! These are the first steps to follow when you want to manage an IoT project: 1. START WITH ''WHY'' As Simon Sinek would say, you’d better start with the “why” before launching any useless project. So, why do I want to launch an IoT project? Do I want to launch something that makes my company look trendy and innovative? Do I want to save cost by optimizing my business processes (maintenance, operation, production, etc.)? Do I want to enable new business models into my company offer, thanks to the IoT opportunities (renting vs selling, data value, new services, service vs product, etc.)? Do I want incremental innovation to refresh some of my products? Do I want to use the project as a Trojan horse to digitalize my company? Over the past few years, I have seen all of these motivations among management teams, and all of them are fine. But, you cannot pursue all those goals at the same time, and you certainly won’t design the same project depending on the choice you make. As we say in French “choisir, c’est renoncer” which would translate into something like “Choosing is giving up”. So take time to clearly state your motivations and then select one that needs to guide your focus in the coming months. 2. DESIGN USE CASES AND MAKE ASSUMPTIONS  Easier said than done, but first forget about technology/product, and just think about what IoT could allow in your environment and to which customer this could be most valuable. Draw several customer “journeys” and see where innovation could be used as painkiller or gain creator. Let’s take the example of a maintenance scenario. The idea is the allow remote action for on field devices. For instance, coffee machines installed into gas stations all over Europe. In that case, ask yourself how IoT could make maintenance more efficient? Try to assess time gain, money gain, and security gain and quantify it. Let’s say you identified that among 1000 machines installed, you have a high chance of having 5 customer claims per week and therefore 5 diagnosis to be done per week. Can IoT help you run the diagnosis remotely? Can IoT help you solve the problem remotely? In that case, will that save all on site trips? How much money would that save for the company operating the machines? Knowing that, you can start building a first draft of business models making assumptions: how much of that value can you take? What is the business model you can build around that? How much will it affect your customer process? Have you got the right distribution channel to sell this new offer? Which key assets and activities would you need to bridge the gap between current status and this innovation? 3. GET OUT THE BUILDING Use cases and key assumptions in your pocket, you will now need to go and meet potential customers and partners. The more you share, the more your project will evolve to a credible scenario. Who in your existing base can be your early adopters? Who are your customer having the pain you ease at the highest level (and it is even better if they try to solve it themselves with a workaround). In our example of remote maintenance, they would have some artisanal webcam system on each site to see the machine state and detect some issues without any on-site intervention. Once you’ve identified 5 to 10 contacts, go out and meet them, and try to understand several things : the high level stakes, the problem they have on the field, the way they have tried to solve it, the change process and stakeholder, and then (and only then) you can present your innovation and collect feedbacks. A few slides are enough to present. There is no need for a prototype or any bigger investment. You will be amazed on the quantity of information you can collect that way. And remember something: don’t listen to what people say, look at (or try to understand) what they actually do. 4. BUSINESS MODEL AND FUNCTIONAL SPECIFICATIONS You had your first iteration, congratulations! You wrote down assumptions, you went on the ground to test them, and you collected valuable insights from your targeted customers. Maybe your assumptions proved fully wrong, then go back to stage 2! Otherwise, lucky you, you can write down a v1 of the business model and define your product functional specifications better. This is where you can start defining features, functionalities, prices, offers, channels, technical constraints, cost, financial figures, etc. At the end of this stage you will have some kind of a business plan, a sales pitch, functional specifications, and maybe even technical specifications for your IoT project. 5. POC, POC, POC  That is one of the hardest part of any innovative project: build a Proof Of Concept and test it. Questions are: what are the key features/attributes that I need to test to prove that my concept makes sense for customers? How can I do that as cheap as possible in order to keep my budget for the real product? You’ll need to be very smart, or pay some smart provider, to be able to degrade your end vision so much to just keep the key attributes you want to test. If we go back to the remote maintenance example, can you build some basic software on a Raspberry Pie Board connected to the machine, coupled with a basic web interface that give critical information on the machine, for instance power consumption, run time, temperature, etc. Even if the final product won’t be using raspberry, if you want the web interface to be embedded into an app, and if you want to have twice as much indicators, just focus on the key elements. And test. Doing so, you’ll allow your customer to see real progress, to feel involved in the development process, and to influence the final outcome. And on your side you will collect key information that would take months or even years to collect if you had done it on the real product. A Proof Of Concept can be a functional prototype, or a design prototype, or both. That is pretty much depending on the project and again on the key attributes/functionalities you want to test. 6. ANOTHER LOOP TO COME Congratulation, you’ve made another loop. You are about to become expert in so called “iterative development”! If you don’t feel so, don’t worry as you’ll have many other loops following the same process: make assumptions, test, measure, learn, adjust and make new assumptions, test, measure … Each loop will allow you to adjust the business model, the functional specifications, the customer engagement and go further into your product development. The complete ''Lean startup process'' The key is to keep in mind that your goal here is not to have the perfect product. It is just to be able to learn as much as possible in each loop while spending as less as possible. Make as many loops as you can until you reach a satisfying v1 product brief. But that is for chapter 2… Originally Written on WITEKIO Technical Blog by Samir Bounab, Chief Sales Officer, WITEKIO 15 September 2017
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e-con Systems announces their new System-On-Module aimed for Applications which require higher GPU performance and faster network connectivity. eSOMiMX6PLUS System-On-Module is based on NXP’s QuadPLUS/DualPLUS ARM Cortex™ A9 Processor running up to 1.2GHz, featuring 3 high speed Camera interfaces with support for 13MP Camera and supporting 802.11 ac Wi-Fi network. The eSOMiMX6PLUS at volumes is available at USD79 onwards and samples can be bought from the Webstore. Customers wanting to evaluate thee SOMiMX6PLUS, can do so by ordering the AnkaaPLUS development kit from e-con’s Webstore. The development kit, among other accessories, also includes a13MP camera board, 5MP camera board and 7” LCD panel. 
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As many customers find it difficult selecting an Operating system for their next product on a given platform Adeneo Embedded put together a very detailed comparison between Linux and WEC7 on the i.MX53 platform. This comparison documents everything from the time it takes to setup the platform, create the first builds to performance and power consumption benchmarks. Below is a snapshot of the contents of the document.   To get access to the complete document, please contact Adeneo Embedded at sales@adeneo-embedded.com
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Added by Renato Frias on May 19, 2010 at 4:27pm   http://www.youtube.com/watch?feature=player_embedded&v=gQNTkpGY3LY   Uploaded by DDoiS on May 18, 2010 Camshift object tracking algorithm applied on a Color segmented Image and Low/High pass filters being performed on the i.MX51 Freescale's processor (EVK Board) running on the LTIB linux (without X window system) using the OpenCV Library. Category: Science & Technology License: Standard YouTube License        
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The wait is over! Toradex announces the launch of its latest technical support feature, the Toradex Community, an online community that aims to provide customers a unique platform to stay connected with the Toradex engineers. Toradex, which has always provided extensive free and direct technical support from development engineers, recognizes that many of its customers often have similar queries. By providing an online community where anyone may post a query and by publicly listing down the engineers’ responses, Toradex anticipates that the entire community will stand to benefit from the collective knowledge available via the forum. “We invested a lot of time to understand what information our customers most wanted access to and how to deliver it in a simplified, user friendly and timely manner. With the launch of the Toradex Community platform, our aim is to create an even more connected and responsive support system for our customers, while enabling easy access to information. We invite you to be a part of this ever-growing community constituted by our embedded enthusiasts.” said Roman Schnarwiler, CTO, Toradex. The community will serve to provide its members with sustainable solutions and key insights from our experienced engineers who will be answering queries related to the usage of Toradex products in a wide variety of embedded applications. Furthermore, it will complement the exhaustive information available on the Toradex Developer Center, which is a resourceful website that brings all of Toradex’s developer resources together at one place. For an overview about all our available support channels, please check our support page. About Toradex: Toradex is a leading vendor of ARM based System on Modules (SOMs) that can be used for diverse embedded applications. Powered by Freescale® i.MX 6 & Vybrid™, NVIDIA® Tegra, and other leading processors, the SOM families offer a wide range of options in terms of price, performance, power consumption and interfaces. Complemented with the long-term availability of 10+ years for its products, Toradex stands out in the embedded computing market with free lifetime product maintenance, pin-compatible product families for scalable designs, direct premium technical support, and transparent pricing with direct online sales. Founded in 2003 and headquartered in Horw, Switzerland, the company’s network stretches across the globe with additional offices in the USA, Vietnam, China, India, Japan, and Brazil. For more information, visit https://www.toradex.com. For media queries, please contact: Lakshmi Naidu: lakshmi.naidu@toradex.com
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MYIR launches a 7-inch HMI display panel with capacitive touch screen, the MYD-Y6ULX-CHMI, which runs Linux on NXP’s i.MX6 ULL ARM Cortex-A7 processor, is specially designed for HMI system like POS, intelligent access control and more other applications. It provides many peripheral interfaces and much software resources. Know more at MYD-Y6ULX-CHMI | 7-inch HMI Display Solution based on NXP i.MX 6UL/6ULL-Welcome to MYIR 
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use AdvancedToolKit1.71 earse NANDFLASH,display error ,why ?      FLASH     K9F2G08U0C-SIB0
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3a Added by Ruslan on June 15, 2012 at 12:29pm    
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In this new version, the experts at GuruCE have achieved some major improvements in performance and added quite a lot of new functionality: 4.75x faster than our previous release This is >6x faster than our competitor's BSP... Added full HDMI support, including display auto-detection, hot-plug and dynamic resolution changes in CE This means you can plug in a 1360x768 monitor and have the CE desktop shown in that resolution, then unplug the monitor and plug in a 1920x1080 monitor and CE will dynamically change resolution and show the desktop in 1920x1080 resolution, all this of course without the purple line on the left (a long-standing problem in all the other iMX6 BSPs available). HDMI, LVDS and LCD display output is now configurable in the bootloader This means you can have one kernel image for all. Just go into the bootloader menu and select which display you are using at which resolution and launch the kernel. Simple as that! Added support for DMA on all UARTs Full RX & TX DMA support on UART1, 2, 3, 4 and 5. Upgraded to the latest Vivante GPU GALCORE driver v5.0.11 (25762) And we added all the tutorials and test code as well. Together with the amazing performance increase of this release you can now enjoy 110+ fps in full-screen 1920x1080 (and 350+ fps windowed) for OpenGL-ES 1.1/2.0! The OpenVG spinning tiger sample is now so fast you only see a blur, and we fully support OpenCL on Dual and Quad of course. Now asynchronously loading drivers for faster boot Added free downloadable demo kernel for Congatec-QMX6 (Dual/Quad, 1 GB module) on a QKIT-ARM Maximum CPU temperature at rest: 45°C / 113°F Maximum CPU temperature while running OpenGL-ES 2.0 reflecting ball: 65°C / 149°F This is not nearly as low as we would like, but it's a lot better already. Our next release will focus on power consumption and heat generation reductions. Improved network performance The performance improvements also make Ethernet throughput a lot better. We're only halfway to reaching the theoretical maximum possible on the iMX6 of ~45 Mbyte/s (it's on our list of things to fix), but at least Ethernet speeds are out of the KByte range now (tested using NETIO on WEC7 & WEC2013): NETIO - Network Throughput Benchmark, Version 1.32 (C) 1997-2012 Kai Uwe Rommel TCP connection established. Packet size 1k bytes: 19.11 MByte/s Tx, 19.22 MByte/s Rx. Packet size 2k bytes: 21.22 MByte/s Tx, 20.38 MByte/s Rx. Packet size 4k bytes: 22.44 MByte/s Tx, 20.85 MByte/s Rx. Packet size 8k bytes: 23.06 MByte/s Tx, 22.43 MByte/s Rx. Packet size 16k bytes: 20.67 MByte/s Tx, 19.38 MByte/s Rx. Packet size 32k bytes: 20.79 MByte/s Tx, 20.58 MByte/s Rx. Done. UDP connection established. Packet size 1k bytes: 13.84 MByte/s (0%) Tx, 13.76 MByte/s (0%) Rx. Packet size 2k bytes: 15.97 MByte/s (0%) Tx, 15.97 MByte/s (0%) Rx. Packet size 4k bytes: 20.25 MByte/s (0%) Tx, 19.83 MByte/s (0%) Rx. Packet size 8k bytes: 22.39 MByte/s (0%) Tx, 22.49 MByte/s (0%) Rx. Packet size 16k bytes: 19.34 MByte/s (0%) Tx, 17.95 MByte/s (0%) Rx. Packet size 32k bytes: 21.78 MByte/s (0%) Tx, 21.17 MByte/s (0%) Rx. Done. Further details in the release notes. Don't believe the hype? Try it yourself! We've got free downloadable demo kernels for the RIoTboard, the SABRE-Lite, the Nitrogen6X, the Opal6, the ConnectCore6 and now also the Conga-QMX6. GuruCE website: https://guruce.com iMX6 landing page: https://guruce.com/imx6 Latest iMX6 BSP r474: https://guruce.com/imx6-bsp-releases/imx6-r474
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i.mx233 Computer on Module Added by Lucas Loizaga on August 1, 2010 at 5:03pm First 3D image of our i.mx233 SODIMM CoM!  
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iWave Systems, Proven Partner of Freescale Semiconductor and a leading Embedded Hardware, FPGA and Software Turnkey Design Services and Solutions company, presents improved i.MX 6 Qseven Development Board RainboW-G15D that supports following  sensors: 3-Axis Accelerometer Digital e-Compass Ambient Light Sensor Altimeter/Barometer These sensors interfaced with the iMX6 processor using I2c interface for internal communication and data transfer and also possess INT (interrupt) signal to interrupt the processor about the data. The RainboW-G15D development kit with Linux 3.0.35 BSP supports these various sensors. 3-Axis Accelerometer: This Accelerometer sensor is used for Static orientation detection (Portrait/Landscape, Up/Down, Left/Right, Back/Front position identification). Motion detection for power saving (Auto-SLEEP and Auto-WAKE). Shock and vibration monitoring. Digital e-Compass: The digital e-compass sensor is used for measuring magnetic fields with an output date rates up to 80Hz (ODR). It acts as electronic Compass with accurate heading information. Location Based Services. Ambient Light Sensor: The ambient light sensor is used for measuring the light rays, it uses the photo detectors to convert the light energy into electrical energy. Altimeter/Barometer: This sensor is used for Measuring the pressure/altitude and temperature, it uses ADC to convert physical parameter into electrical. About i.MX6 Qseven Development Board: The Development Platform incorporates Qseven compatible i.MX6x SOM which is based on Freescale's iMX 6 Series 1.2GHz multimedia focused processor and Generic Q7 compatible Evaluation Board. This platform can be used for quick prototyping of any high end applications in verticals like Automotive, Industrial & Medical. Being a nano ITX form factor with 120mmx120mm size, the board is highly packed with all necessary on-board connectors to validate complete iMX6 CPU features. About i.MX6 Qseven System On Module (SOM): iW-RainboW-G15M is Freescale's i.MX6 based Qseven compatible CPU module for faster and multimedia focused applications. The module has on-board expandable 1GB DDR3 RAM, micro SD slot and optional eMMC flash. With the extreme peripheral integration, the module supports industry latest high performance interfaces such as, PCIe Gen2, Gigabit Ethernet, SATA 3.0, HDMI 1.4 and SDXC etc. About iWave Systems: iWave has been an innovator in the development of “Highly integrated, high-performance, low-power and low-cost i.MX6/i.MX50/i.MX53/i.MX51/i.MX27 SOMs”. iWave helps its customers reduce their time-to-market and development effort with its products ranging from System-On-Module to complete systems. The i.MX6 Pico ITX SBC is brought out by iWave in a record time of just 5 weeks. Furthermore, iWave’s i.MX6/i.MX50/i.MX53/i.MX51/i.MX27 SOMs have been engineered to meet the industry demanding requirements like various Embedded Computing Applications in Industrial, Medical & Automotive verticals. iWave provides full product design engineering and manufacturing services around the i.MX SOMs to help customers quickly develop innovative products and solutions. For more details: i.MX6 Q7 Development Kit | iWave Systems email: mktg@iwavesystems.com
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Launched on Kickstarter on Monday 20 April 2015 – Funded in 80 minutes The groundbreaking Single Board Computer reached its 15k goal on Kickstarter in 80 minutes. UDOO Neo merges the world of Arduino™ and Raspberry Pi with wireless connectivity and 9-axis motion sensors, providing a complete and easy solution to free your imagination, make your objects alive and create new smart devices and appliances from scratch. Campaign Link: bit.ly/UdooNEO On Monday 20 April 2015 SECO USA Inc. launched UDOO Neo on Kickstarter at 11 o’clock in EST time, raising the 15k USD dollar goal in just 80 minutes. The first to be astonished by the overwhelmingly successful launch are UDOO Team members: “We felt immediatly a great interest for the NEO, but we weren’t expecting such enthusiast reaction. This confirms that we’re in the right direction: people are eager to get involved in the Internet of Things computing, and UDOO NEO seems their perfect companion” declares Maurizio Caporali, NEO’s product manager. UDOO Neo is a credit-card size (59.3mm x 85mm - 3.35" x 2.33"), low-cost, low-power consumption, open-source hardware board, able to run Android or Linux and Arduino-compatible. It can be used as a fully-fledged computer, as an Arduino-compatible microcontroller or as an embedded computer to build new devices, smart objects and appliances. UDOO Neo comes in two versions: UDOO Neo Basic and UDOO Neo. UDOO Neo Basic has 512MB of RAM, one USB port, one micro USB OTG port, HDMI video output for LVDS and touchscreen, Wi-Fi module, Bluetooth 4.0 module (including Classic Bluetooth and Bluetooth 4.0), analog and digital camera connection, 54 GPIOs and MicroSD card for the operating system. In addition to all the features of UDOO Neo Basic, UDOO Neo has also a fast ethernet (10/100 Mbps), 9-axis motion sensors embedded, and it has 1GB of RAM instead of 512MB. UDOO Neo is the result of a joint effort between SECO (http://www.seco.com/en/welcome-seco) and Aidilab (http://aidilab.com/). SECO is a global leader in the B2B embedded market, with 36 years of experience in design and production of electronic embedded solutions. AidiLab is a design studio founded as a startup of the Interaction Design Lab (IDA) of Siena University (http://www.unisi.it/) thanks to passionate efforts of professors and students. It collaborates with SECO in the hardware and software development of UDOO, and manages the communication and the relation with the user base. “UDOO Neo is a new-generation single board computer, ready for Internet of Things applications thanks to its wireless connectivity and embedded sensors that no other board on the market features right now.” says Maurizio Caporali, Product Manager of UDOO Neo. UDOO needs the funds to keep the price low, this is the reason why it will be launched on Kickstarter. Right now, a $49 pledge is the minimum to get a UDOO Neo Basic and $59 to get a UDOO Neo. SECO aims to ship the boards to customers in September 2015. Contact info@udoo.org for further inquiries. www.udoo.org
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Вебинар по продукции TechNexion "Процессорные платы на базе iMX6 (ARM)" OK, maybe not everyone of you speak Russian. For example I don't speak. But I know there is a big Russian community out there, developing great stuff just like the rest of us by using ARM Processors. This Friday Ilya from IPC2U will hold a Webinar to give a Technical overview about the capabilities ARM processors have and how you can use them in today's world. I had a chat with Ilya and he told me he is planing to give a overview why ARM now is more suitable to be used in many different industrial areas due to increased capabilities and the increased usability of Linux. I had the luck that Ilya gave me an overview about what he will present, so even my Russian is limited (limited as in 'non existing') I still get some useful updates, even for me. The Link to register is here: http://ipc2u.ru/news/webinars/processornye-moduli-na-imx6-arm/ It's at 11:30 Moscow time (I guess, please check link above) and the Agenda is like this: Темы вебинара: Что такое ARM Семейство процессоров iMX6 на базе архитектуры ARM Cortex-A9 О компании TechNexion Обзор продукции компании TechNexion (встраиваемые системы, панельные компьютеры) Подробный обзор процессорных модулей формата PICO Talking with Ilya he told me this Agenda is roughly and he will cover like this: -ARM overview -ARM for industrial usage -NXP and it’s ARM i.MX6 Processors -TechNexion Product overview -TechNexion PICO Modules in detail -Q&A I don't know if there is a limit in maximum people to attend but 1h ago Ilya told me he is overwhelmed by the sign up rate of people... ..so you better hurry if you speak Russian and want join! Hey you are attending? Tell me here how it was after it, ok? Looking forward to hear from you Florian P.S.: I work for TechNexion. Thats the Company IPC2U is talking about in this Webinar, just to be clear about that. Me: florian12​​
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http://www.youtube.com/watch?v=GN0VzR7b6IQ&feature=player_embedded   Published on Jul 10, 2012 by freescale http://www.freescale.com iWave Systems Technology Pvt Ltd, headquartered in Bangalore India, provides smart design solutions in embedded systems. iWave enables its customers shortest time to market through its proven i.MX SOM & Development platforms. Together with their US Partner, FirstView Consultants, based in Austin, TX, iWave provides local service with offshore prices. iWave's latest i.MX6x based SOM is available both in MXM (for automotive) and in Q7 (for medical, industrial) form factor with complete BSP for latest Android 4.0, WEC7 & Linux 3.0.15. Category: Science & Technology License: Standard YouTube License
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iWave Systems launched two additional SOMs based on i.MX 6QuadPlus (iMX6QP) and i.MX 6DualPlus(iMX6DP) adding to its existing i.MX6 SOM portfolio.  The new i.MX6QP and i.MX6DP CPUs from NXP provide increased memory bandwidth without any major changes in the software and hardware. This provides 90% enhancement in the memory efficiency compared to i.MX6Q / i.MX6D. The 2D and 3D graphic engine performance of these new QP and DP devices are improved more than 50% compared to the predecessors- i.MX6 Quad and Dual core devices. Check the performance improvements of i.mx6QP / i.mx6DP device here. iWave Systems launched the i.MX6 QuadPlus and DualPlus CPU based Qseven compatible System On Modules (SOMs) at the same time as NXP launched the i.MX6 QP/DP chipsets. These modules are supported with Linux and Android BSP support. More information about imx6QP / imx6DP modules can be found here.
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Freescales i.MX 6 family provides product developers with the computing power of consumer applications for use in the industrial and automotive sector. Rich Industrial Interfaces i.MX 6 processors offer a wide range of interfaces that render these devices suitable for industrial use. These include Gigabit Ethernet, PCI Express and SATA 2 that are integrated into the processor. The two Flex CAN interfaces make i.MX 6 processors specifically suitable for automotive as well as industrial applications. All interfaces provide an I/O voltage of 3.3 V. Accordingly, in most use cases there is no extensive signallevel adjustments are needed for design-in of the processor, thus simplifying peripheral circuitry design. The phyFLEX-i.MX 6 System on Module Highlights The i.MX 6 controller (Cortex-A9) can internally comprise one, two or four cores.This means that the computing power of the same controller is scalable i.MX6 Single, Dual, Quad core Up to 1,2 GHz / core VPU, IPUv3H, GPU2Dv2, OpenVG 1.2 Up to 4 GB DDR3 / 16 GB NAND SD/SDIO/MMC USB 2.0 OTG and Host PCIe, SATA II CAN, UART, SPI, I 2 C, I2S Camera interface Up to 4 displays + HDMI Linux and Compact 7 BSPs phyFLEX-i.MX6 interfaces are routed to our high-density PCB interconnects on the underside of the SOM. Design the mating connectors on your carrier board. HARDWARE-MANUAL    ---    LINUX QUICKSTART    ---    WINDOWS EMBEDDED COMPACT 7 QUICKSTART
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ConnectCore for i.MX51 Windows Embedded CE 6.0 Development Kit Added by Mike Rohrmoser on July 29, 2010 at 7:38pm   Digi JumpStart Kit for Windows Embedded CE 6.0 R3  
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http://www.youtube.com/watch?v=K9UXhZSYphw&feature=player_embedded   Published on Apr 20, 2012 by iWavesystems The Platform is based on Freescale's i.MX508 processor which is a system-on-chip (SoC) that incorporates high performance 800MHz ARM Cortex-A8 processor along with on-chip EPD and LCD Controller. Lower power consumption of ARM Cortex-A8 eliminates the need for heat dissipation and helps developers to design silent, air-tight enclosed solutions. The i.MX50 Quick Start Board comes with 256MB Low power DDR2 and 4GB micro SD card loaded with boot code and Linux . The Quick start board supports Standard SD port for SDIO expansions, 10/100Mbps Ethernet, Micro USB 2.0 Device port, USB 2.0 Host Type A port, Headphone Audio IN & Audio OUT port, DB15 VGA display out port, DB9 Debug Serial port, JTAG connector and Expansion connector port for EPD & LCD expansion. This enables developers to quickly prototype their application needs around i.MX50 processor and optimize the development effort and time to market of their products.Board Support Packages for Linux and Android is available for the i.MX50 Quick Start Board.iWave Systems also launched EPD Add-On module and LCD Add on Module for i.MX50 Quick Start Board for quick validating of different display interfaces capability of i.MX50 CPU. Category: Science & Technology License: Standard YouTube License  
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