IMXRT1064 Production package

[vasudhevan]

Hi,

We can design board using this chip. But few difficulties  as below

 1. This chip is 0.65mm pitch BGA. Need to use via drill less than 12 mils. 

2.  There are signal pin are in innermost array of package too. This will add more number of routing layers on board.. ( about 6 layers at least).

3. Not easy test and debugging.

My suggestion on selecting a bga part  is bga pitch >1mm, power pins in inner most row and columns. Limit to 14 rows x 14 columns.

This question from pcb designing team nxp having any suggestions ?

Thanks & Regards

        Vasu

[Harjit]

There is an industrial version of the part (iMXRT1064IEC) that is 0.8mm pitch (12mm x 12mm).

[vasudhevan]

Hi Harjit Singh,

    Thank you for your reply.

         Industrial part does't contains LCD we need lcd also. 

[fangfang · Accepted solution]

Hello,

 For the PCB design please refer to the EVK layout file(i.MX RT1064 Evaluation Kit | NXP ) which is verified by NXP. And one can find the more information Hardware development guide for the MIMXRT1060 processor https://www.nxp.com/webapp/sps/download/preDownload.jsp?render=true .

Have a nice day.

Best Regards

[vasudhevan]

Hi fangfang,

   Thank you for reply.

       NXP supports private message schematic review submission ?

       If support means how to submit ?

Thanks & Regards 

         Vasu

[fangfang]

Hello,

You are welcome.

Yes. We can support it. Please submit a ticket on our website . Please refer to the document how  to submit it.https://community.nxp.com/docs/DOC-329745.

Best Regards

[vasudhevan]

Hi,

    Thank you fangfang.