i.MX6 Quad/Dual chip force limit

[andychien]

Dear Sir,

Customer ask about chip force limit  on the i.MX6 Quad/Dual die itself when the heat-sink/thermal pad is torqued down?

 I found NXP AN4871 documents about Assembly Handling and Thermal Solutions for Lidless FCBGA.

i.MX6 Dual/Quad are 21x21mm package, but below table 5 doesn’t have 21x21mm body size info.

Could you help check and provide it?

Thanks a lot,

doesn’t have 21x21mm body size info.

[igorpadykov]

Hi Andy

below recommendation from app team:

"NXP recommends that the maximum load force not exceed 10 lbs, particularly for unlidded devices."

Best regards
igor
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