S32K118, LQFP64 package, chip corner exposed copper wire problem

[zhangzhiyong]

FS32K118LFT0MLHR is the material model used in our current BMS products. For the current SOT1699-1: LQFP64 packaged product, all four corners of the chip purchased by the agent have exposed copper wires, similar to a pin being cut. Is this normal? Is there a detailed process description corresponding to this LQFP? What are the risks in product design? I look forward to your reply. Thanks a Lot !

[danielmartynek · Accepted solution]

Hi @zhangzhiyong,

This is normal, this is a part of the lead-frame that is used to support the chip during the assembly.

You can search for lead-frame on the internet.

This is an x-ray picture of an MCU (not S32K)

Regards,

Daniel