CY, I might get the full information you need, but I am confused from the DS.
Is the chip 132 pads type or 256?
Are you using the bare PQFP package or the chip on a carrier adapter?
Please answer (and if you have the chip picture) and I might get for you the the PCB footprint and maybe 3D too
Ben
Hi CY,
There is an application note AN4388 about QFP package PCB design.
Wish it helps.
Have a great day,
Mike
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Actually I too got the same pdf from NXP website but it is not giving enough information on land pattern.
Hi Ben
I am not sure what is EH in MPN. This one we got it from our customer.