During the current acquisition function test of MC33772B, we found that there will be current jump at specific temperature points (around 45 ℃ and 113 ℃) (the original side current is 300A and the jump range is about 300mA). Is it related to the temperature correction of 33772, as shown in the following figure. If so, can it be corrected by software? Whether the current acquisition jump performance of different batches of chips is consistent?
But I don't think this jump is caused by error, or whether it will have serious consequences
The MC33772B current sense acquisition gain error is specified as +/-0.5%. If a SW correction is needed then a calibration should be done taking into account the BCC temperature, the PGA gain and the shunt temperature. This calibration should be done for each MC33772B