Hello,
The spice model for the BFU660F transistor has 0.385nH package inductance to the collector bondpad but 0.731nH to the base bondpad of the transistor chip. The base inductance is almost twice as high as the collector inductance but the bondwire lengths look similar (see attached xray). Is this correct? The emitter inductance is very low. Is this because the back of the die is the emitter terminal?
Thanks,
John Chiesa. Analog Devices, Chelmsford MA.
