power pads on 48QFN, 32QFN for MKL26

[jwyoungster]

MKL26Z64xxx4:

This is available in a 32QFn, 48QFN and a 64LQFP.

the 32 QFN package: 98ASA00473D.....

the 48-pin QFN package:  98ASA00466D

I see the p[in out list in the datasheet...

what are the pads connected to ?  i.e. pin 49 and pin 33??????...the power /thermal pads under the parts?

is there a document (besides the "pinout list") that highlights WHAT IS and WHAT ISNT available from package to package?

please respond to jyoung@dcscorp.com

[nxf63973]

Hi John

Could you please take a look at the table KL26 Signal Multiplexing and Pin Assignments in the datasheet?

This table shows the signals available on each pin and the locations of these pins on the different packages of the MCU. A part of this table is shown below.

Please let me know if you need any more information.

Jose

[nxf63973]

Hi John

Could you also please look at the document Electrical Connection Recommendations for the Exposed Pad on QFN and DFN Packages?

This has some information about how to properly connect the Exposed Die Attach Pad of QFN packages.

For more information about the packages, please refer to the documents SOT617-17 and SOT619-22. These have information about packages HVQFN32 and HVQFN48,  used in the MK26Z64xxx4 MCUs.

Please let me know if you need any more information.

Jose

[jwyoungster]

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