ESD robustness of ICODE SLIX

[naokiokazaki]

Hi Team,

We are using ICODE SLIX right now.

Could you let me know which bonding method is strong for ESD, 2 pads bonding or 4 pads bonding?

If you could recommend the 2pad bonding, please let me know the reason also.

As for 2 or 4 pads bonding, please see the attached file?

Best regards,

NA

[Jonathan_Iglesias]

Dear Naoki Okazaki,

Hope you are doing great, We would actually expect the same ESD behavior between the “old” and the “new” design.  There are a lot of environmental factors in the assembly process that influence the ESD stress on the IC (pick & place tool, rolls, tilt, ….). To get a better understanding for the different yield you would need to do read outs after each step of the assembly process for the “old” and “new” design. We assume, that you have a proof point (curve trace), that the yield difference is based on ESD.

BR

Jonathan