Now, my customer is designing the product using i.MX8M.
However, their design is held up in PCB layout.
Their product board size is larger than i.MX8M-EVK, and it needs thickness necessarily.
If considering production tolerance for board, It is difficult to fit into the rules defined in i.MX8MDQLQ Hardware Developer’s Guide.
Possibly, doesn't the rule defined in Hardware Developer’s Guide fit a board with large size or thick?
Is there any advice for the board of large size or thick?
The request specification for their board is as follows.
180mm x 130mm（t=1.6mm）