I'm creating a PCB design using LPC4088 in the TFBGA208 (SOT950-1) package. There is no recommended PCB footprint on the datasheet and there is conflicting information between NXP documents.
This document states that the PCB pads should be 0.475mm diameter, and the solder paste should be 0.425mm diameter:
This document states that the PCB pads and solder paste should both be 0.35mm diameter:
Which is correct?