We are currently working on a application wherein a board, carrying accelerometer, gyroscope, MCU and BLE, is embedded in a product which is thrown at a high speed towards the ground. We are unsure whether the shock propagating through the product's outer layer and to the board, would surpass the limits for each component on the board. How do we test this? The product has a stuffing between the outer surface and the board that dampens the blow but we aren't sure of its effectiveness.
Any help in this regard would be much appreciated. Looking forward to your prompt response.