Today’s Infotainment systems are an important part of the driving experience. Complexity of these systems is increasing yet OEM development schedules are being compressed to bring consumers the latest in connectivity, entertainment, and security, at the lowest possible cost. A group of industry experts will discuss: How to approach platform development (customer specific vs market segment). The winning architecture at the system and IC level (distributed vs integrated solutions)? Managing quickly changing technologies such as displays, connectivity, security? How to continue development of increasingly complex software systems. Will the Infotainment system become a cockpit electronics module? How to manage mixing infotainment and safety-related functions like cluster indicators and “convenience” ADAS features?

Plasma cleaning has been used extensively in the IC packaging industry for cleaning assembly materials to improve its cleanliness for the subsequent process, and enhance the overall package or device reliability. One of the challenges is how to establish the compatibility of the cleaning process as various materials are exposed to the plasma. The control of contamination is very important with the recent use of Cu wires in IC packaging. Bond pad corrosion has been found to be critical in device and package reliability and this is one of the main issues that will be tackled in this paper. Evaluation results that include surface analysis and reliability testing using the different plasma cleaning configurations and its other applications will be presented.