Hi,
There is an application note AN4982 about MAPBGA package.
More detailed info please check here.
For pitches at or below 0.65 mm, the solderable diameter is generally larger than one-half pitch in diameter:
Wish it helps.
Have a great day,
Mike
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Thanks but my question is do I have to go Micro-via. or can i have a via in the channel to escape tracks out. Much appreciated.
Hi,
Sorry for the later reply.
Please refer the FRDM-K28F board PCB design files from below link:
FRDM-K28F - Printed Circuit Board bill of Materials and Design Files
FRDM-K28F|Development Board|Kinetis K27/K28|NXP
There provides the MK28FN2M0VML15 chip BGA fan-out reference design.
Wish it helps.
Have a great day,
Mike
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Note: If this post answers your question, please click the Correct Answer button. Thank you!
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That's Great, thank you very much for all your help, take care.