Accelerometers, Magnetometers, Gyroscopes, Pressure Sensors. Gathering sensor data at 400 samples per second, on 9 axes, results in 700 MB of data per day. This hands-on class will show what information is contained in sensor data and how to reduce the amount of recorded data dramatically without any major loss of targeted information. They will then compare data between dumb and intelligent data loggers, and understand the techniques used to compress the information.

Accelerometers, Magnetometers, Gyroscopes, Pressure Sensors. Gathering sensor data at 400 samples per second, on 9 axes, results in 700 MB of data per day. This hands-on class will show what information is contained in sensor data and how to reduce the amount of recorded data dramatically without any major loss of targeted information. They will then compare data between dumb and intelligent data loggers, and understand the techniques used to compress the information.

Accelerometers, Magnetometers, Gyroscopes, Pressure Sensors. Gathering sensor data at 400 samples per second, on 9 axes, results in 700 MB of data per day. This hands-on class will show what information is contained in sensor data and how to reduce the amount of recorded data dramatically without any major loss of targeted information. They will then compare data between dumb and intelligent data loggers, and understand the techniques used to compress the information.

This session will cover Human Machine Interface (HMI) design principles, best practices for developing a user experience, and optimizing art assets for embedded devices. This session is for people in the trenches - designers, programmers, marketers, even your boss. Put the "H" in the HMI and learn how to make interfaces for real humans. Learn how to optimize your assets. Take that million polygon count with 4k textures and run it in your device. Save the day, make it work.

Many existing safety applications, e.g., in railway signaling, are based on aging, proprietary computing systems. These range from hard lock-step, hardware voting architectures, to software-based voting. Each approach brings costs in performance, scalability, life cycle and software development/portability. Some have not achieved Safety Integrity Level (SIL) 4 certification (per the EN 5012x rail standards), which is now a worldwide requirement. This presentation gives an overview of an architecture for a COTS fail-safe computer (ControlSafe™) that combines “loose” lock-step with hardware voting, to provide software transparency, scalability and SIL4 certification. The platform employs distributed Freescale QorIQ processors. Leveraging such a platform, safety application providers can plan technology refresh while maintaining the investment in/focus on their application software.

The Freescale RF Power Tool system is a customer enablement testing methodology that allows the lesser equipped RF design companies to easily and cost-effectively evaluate the latest Freescale RF power devices. The tool is an integral set of both an RF generator and a test fixture monitored by a wide variety of DC and RF sensors. In this class, we will cover the capabilities and limitations of the RF Power Tool system, dive into some of the options of available measurements, and list why those specific operating parameters which are most important to customers.

Introducing a temperature dependent current limit for motor drivers. This thermal management scheme ensures high efficient operation by reducing switching losses when the motor is experiencing heavy loads or binding.  In the presentation we will discuss factors determining power dissipation in a motor driver integrated circuit examining dynamic and steady state operation and the effect on junction temperature. We will review how to calculate an estimate of power dissipation using the information provided in a typical motor driver data sheet. With an understanding of how power is dissipated in a motor driver, we will introduce a new system using temperature dependent current limit that will protect both the driver and the motor.

Learn about Freescale’s pressure sensors and how they specifically support patient monitoring data collection. These sensors can maximize content collected from patient analytics to transfer to the cloud (Big Data) to enable doctors and health providers to determine patient health, analytics, compliance to medical protocols and adherence of the patient to doctor’s instructions.

Macronix Inc. launched its newest MX25R family of Flash memories, targeted specifically for the IoT and other energy conscious applications, such as wearable and mobile devices. The new MX25R product family focuses on lower power consumption to enabling extended battery life. This new product family will offer densities from 512Kbit up to 512Mbit. It support an industry standard memory interface, ultra-small product packages plus Known Good Die (KGD) option for System in Package solution.

This session will discuss a functional, cost and design cycle analysis of product development using SOMs, WaRP Board, custom board and SCM6D based products. This analysis will focus on several design scenarios facing customers and how each of the 4 solutions discussed compare. Further to the analysis will be discussion on time to market studies as well as software development impacts to product lead time. Following this class, you should be better prepared to utilize Freescale SCM portfolio to get your products to market faster.

With both the i.MX range of application processors, and the QorIQ Layerscape communications processors, Freescale is at the forefront of producing leading edge ARM-based solutions for Wearable, Automotive, Industrial, and Enterprise segments. These devices provide highly integrated, energy efficient, solutions, typically with significant software requirements. With DS-5, ARM provides a common toolchain supporting all of these platforms, delivering best in class compilation, full multi-core debug support, and advanced profiling functionality.

The large scale deployment of the IoT will not be possible without resolving current major security issues and challenges. This can be resolved using few key security software components. From its experience securing smartcard systems, P&R is the first in the industry to get certification agencies to work on certifying its formally proven software to the highest security level. The speaker will describe the key software components already developed by P&R and the ones soon to be available as COTS to Freescale’s customers and partners. He will illustrate them using representative examples showing how such key security components can be used to answer all the critical security challenges of the IoT. The speaker will also present how ProvenCore, a fully secure microkernel and a major component of P&R range of security bricks, has been designed to reach the highest level of security.

Beginning 2016, the European New Car Assessment program (NCAP) will allocate increased scoring measures for pedestrian detection capabilities. This means that any car fitted with technologies that enable detection of a pedestrian in a hazardous situation and as a result perform collision avoidance measures shall be rewarded with an increased NCAP score. These systems must be designed and manufactured based on a solid automotive development flow. This session will address the vision processing requirements for pedestrian detection and provide training on how vision algorithms may be implemented to respond to NCAP requirements in a safe, secure and reliable way.

In this hands-on workshop, we will walk you through examples and use cases of how to use the FlexIO feature on Kinetis MCUs to implement custom logic and enable additional serial interfaces.

Enterprise storage solutions from Freescale with high availability in all aspects of the design will be discussed in this session. Dual socket design with redundant chip-to-chip interconnect, over 80G of network connectivity, redundant power, redundant SAS connectivity to HDD's and multiple NVMe SSD's for high IOPs are some of the core features of this storage solution. Ability to offload storage traffic (iSCSI and FCoE), RAID5/6 offload using AltiVec, RDMA across SRIO along with SEC, DCE and PME engines with optional C29x cards makes this an ideal enterprise-class, secure data center storage solution.

Kinetis M series microcontrollers integrate high-accuracy measurement units (24-bit SD ADC, PGA, VREF) to measure wide dynamic range analog signals with a very low temperature drift.

As technology becomes more closely integrated into all aspects of human life, the microcontroller is essential to delivering the human-to-machine interface, or HMI. Kinetis MCUs based on ARM® Cortex®-M cores integrate a number of HMI capabilities. This session will detail the input and output capabilities of Kinetis MCUs spanning from simple push buttons to advanced displays. You will receive an overview of how to meet the HMI requirements for your next embedded design.

The T1023/24 family of products are the newest QorIQ 28nm Power architecture devices running at 1.0-1.4GHz with both single and dual core options.  The T1023/24 devices deliver up to 2-10x performance over current QorIQ P1 family processor. Learn the key architectural difference between P102x and T1023/24 and recommendations for migrating from P series to T series. Discuss Data Path Acceleration Architecture (DPAA) and the benefits of the DPAA and SEC 5.X offload upgrades.

Automotive integrated circuits are requiring high temperature and high voltage application environments. High temperature and high voltage impose severe constraints on the design of IC interconnect and the materials used in the assembly and packaging processes. The use of fine gauge copper wire bonding has been growing very rapidly in consumer, portable, and industrial electronics. Freescale has made significant inroads in introducing and accelerating the adoption of fine gauge copper wire in the high reliability automotive space. The molding compounds were studied and reformulated to accommodate high voltage up to 65V. This presentation will discuss key learnings in copper wire bonding process and molding compound formulation development, and present an exciting update on Freescale strategy on gold to copper wire conversion.

Many people involved in the electronics industry need a basic knowledge of semiconductor components in order to understand issues like manufacturing cycle time, semiconductor fab consolidation and failure analysis results. This session is geared towards a non-technical audience and gives a high-level overview of semiconductor devices and how they are made. The lecture begins with a brief overview of how semiconductor devices work. The bulk of the presentation describes the generic manufacturing flow for semiconductor devices with an emphasis on the complexity of the equipment/facilities used and the process time required.