Thank you Qiang Li.
We proceeded in the same way as you mentioned in your previous reply. It is found that the board is not completely powering OFF within 2 seconds. There is some leak power remains. But the interesting fact was that a few number of boards fail to boot while the others will work properly without any issue. So we did some X-ray analysis on BGA components (mainly on PMIC) and it found that there is some minor contact degradation for some of the BGA balls. This can happen due to several reasons over a period of time.
We replaced those components and is working fine now. But it is not desirable to replace the PMIC in every 6month. So we optimized the input power supply for minimizing the leak power and optimized the board layout. Ensured the assembly process with recommended temperature profile and board finish made as ENIG.
With these modifications we hope we can override this problem.
Since this is happening after a few months only, we need to see the result after a few months of time.