I have several products in production using HCS08 and HCS12 devices.The HCS chips are all running slightly warm.
I am worried I might have misconfigured I/O lines causing unwanted power consumption.Perhaps unused I/O that is not available externally due to my use of smaller packages.
As far as I can tell this is not the case,but I am uncomfortable with lukewarm CMOS devices.
Am I overthinking this?Is this perhaps normal when running these devices at full speed?
You didn't mention the MCUs, but anyway, the reference manuals should specify
Regarding un-bonded pins, they should be driven either to VDD or VSS as output, they should not be floating.