Explore real world IoT use cases for home, healthcare and industrial applications. Includes a demo of interoperating QorIQ LS1043A gateway, Kinetis device running Thread, WiFi and NXP and 3rd party software for a secure connected solution.

Come find out what's next for the QorIQ multicore processor platform. You'll get the latest details on our networking solutions, including and update on the market on our solutions focus.

QorIQ DPAA has a hardware accelerate decompression and compression engine (DCE) that can be used for storage market and bandwidth optimization applications. This session will discuss the DCE engine, the program model for kernel space and user space application. We will also discuss the performance issue with various open source compression libraries so customer can pick the correct approach for their use case. Watch Video Presentation

Develop your IoT and wearable applications with Hexiwear, an open source, expandable development platform. The platform is expandable with the option to add 180+ additional sensors through click boards.

Learn about NXP's newest technology for Single Chip System Modules (SCM) that provides ultimate customization and tiny form-factor via a unique vertical integration approach. Watch Video Presentation

For drug delivery to be effective, two very important conditions need to be met. First, drug quality needs to be ensured until the time of administration to the patient. Second, the patient needs to adhere to the prescribed therapy. Two easy-to-use solutions will be presented. They comprise a battery, an antenna and a single chip that integrates a sensor, storage and NFC connectivity. Both solutions support wireless communication with a smart phone. A temperature monitoring solution permits logging of transport conditions of each individual drug package at any point in time. Patients and healthcare professionals can confirm the drug quality at the moment of administration. A therapy adherence monitoring solution for drug blisters and bottles records medication intake events. In case the intake deviates from prescription, patients can be reminded and motivated to do better.

Healthcare is ripe for disruption. In this class we will outline how NXP IoT products enable a variety of healthcare solutions that will lower patient costs and improve patient outcomes. Watch Video Presentation

Healthcare devices are adopting more and more technology and NXP is at the center of this trend. Learn about the MCUs, MPUs, sensors, and wireless products that are being used in the most innovative healthcare products. Watch Video Presentation

This hands-on class will walk you through developing two separate applications. First, learn how to leverage a FlexIO driver to add some autonomous monitoring and reaction to sensor data. Secondly, learn how to create a complex parallel interface (TFT driver).

FIDO Alliance is getting huge traction in the secure authentication world and the member count has surpassed 250 companies. Secure Element based FIDO U2F Authenticators add another security layer to consumer online authentication for cloud services and have been deployed for services like Google, Dropbox, Github, and others. These Authenticators are available in various form factors (Cards, USB keys, Fobs, Wearables and embedded) and support multiple interfaces like USB, NFC and BLE to connect users to critical online services using the FIDO authentication protocol. In addition to FIDO credentials, NXP provides vSE based multi-credential (PKCS#15, EAC, BAC, SAC, Mifare, PIV ) as well as an online services platform including eDoc derived mobile credential management connecting relying parties to enable secure mobile authentication for eGov services. Watch Video Presentation

This session will cover the basics of authentication for anticounterfeit applications. Topics covered include use cases and applications, hardware vs. software, symmetric vs. asymmetric crypto protocols, host and device requirements, attacks and countermeasures, and "beyond the chip" security concerns. An intro to the A1006 and A71 product families will also be provided.

The Internet of Tomorrow surrounds us with electronic solutions connected to the cloud. We must be confident they operate safely, securely and with the highest quality and reliability. The autonomous vehicle is the ultimate connected device. This session will highlight 66 critical differences that may exist between automotive and consumer components as identified by an industry expert workgroup that impact reliability, quality and the lifetime of vehicles. This overview of potential differences across markets might be the ideal tool to guide customers in their component selection. NXP is the leader in Automotive, security and connectivity as well as in highest-end computer Networking. We will demonstrate how NXP’s capabilities across product segments and performance ranges addresses many of your hidden risks and providing an excellent starting point towards your connected solutions. Watch Video Presentation

Many people involved in the electronics industry need a basic knowledge of semiconductor components in order to understand issues like manufacturing cycle time, semiconductor fab consolidation and failure analysis results. This session is geared towards a non-technical audience and gives a high-level overview of semiconductor devices and how they are made. The lecture begins with a brief overview of how semiconductor devices work. The bulk of the presentation describes the generic manufacturing flow for semiconductor devices with an emphasis on the complexity of the equipment/facilities used and the process time required. Watch Video Presentation

The NXP supply chain team will present an overview of the new NXP global manufacturing footprint, as well as integrated strategies for supply assurance and crisis management. An overview of current supply chain systems integration activities will be discussed as well as customer order management strategies moving forward. A special focus will be placed on highlighting changes that will affect NXP customers. Watch Video Presentation

This session discusses how the i.MX applications processors interface with the new NXP portfolio. We will review the i.MX processor family and how they can be connected to NXP components to create complete automotive platforms. Watch Video Presentation

Plasma cleaning has been used extensively in the IC packaging industry for cleaning assembly materials to improve its cleanliness for the subsequent process, and enhance the overall package or device reliability. One of the challenges is how to establish the compatibility of the cleaning process as various materials are exposed to the plasma. The control of contamination is very important with the recent use of Cu wires in IC packaging. Bond pad corrosion has been found to be critical in device and package reliability and this is one of the main issues that will be tackled in this paper. Evaluation results that include surface analysis and reliability testing using the different plasma cleaning configurations and its other applications will be presented.

As the Smart Home starts to gather momentum, a number of competing Wireless Communication standards are fighting for dominance. With ZigBee® now becoming dominant in the low-power networking market, there is no surprise that two new low power technology Thread and Bluetooth® Low Energy with the new Mesh capability are both trying to enter this market to get a piece of the cake. Moreover competing IoT platforms from the Thread Group (Google/Nest), Allseen Alliance (Qualcomm), Apple's Homekit, the Open Interconnect Consortium (Intel) and many others are creating even more confusion. So in this confusing array of Wireless Communication standards and Iot platforms, what are the main features of each and what does it means for NXP? This session will provide an overview of these Wireless connectivity standards and IoT platforms, their capabilities, and their implication for NXP IoT. Watch Video Presentation

Smart digitalized packaging as a subset of the Internet of Things - a huge trend impacting global packaging industry today. NXP is the Identification industry's #1 chip supplier for smart secure NFC-RFID technology offering a variety of tag ICs from short to long-range, allowing interaction with mobile phones connecting products to the cloud and customers to brands. Watch Video Presentation

NXP is one of the pioneers in bringing helping bring multicore solutions to the aviation industry and helping customers navigate the certification requirements. This session will cover the roadmap and status of current certification activities, challenges for 2016 we are addressing for both PPC and ARM devices.

Solid state RF energy provides cooking appliance OEMs the opportunity to create differentiated cooking appliances. When combined with emerging food services, these appliances can enable greater levels of consumer convenience while delivering consistent cooking results. This session will cover the underlying basics of how solid state RF cooking is performed, its benefits, and how it can be combined in an IoT appliance to deliver even further differentiation. Watch Video Presentation