Recommended PCB footprint for MaxQFP-100 package?

[hns80]

S0T2045-1 MaxQFP Case Outline shows a recommended PCB footprint that is different than the footprint provided with the hardware design package . The pad centers are slightly different (4.8 and 6.3 vs 4.85 and 6.2mm). Also, the inner pads are shorter in the part provided with the hardware design package (1.4mm in the case outline document, 1.0mm in the hardware design package library).

Which version is preferred?

[vicentegomez · Accepted solution]

The hardware design package, 

Also please check the recommendation for your solder paste supplier

Have a good day