For die sales products, we only accept CQC that already no gel above the die.
Because:
Before starting FA, we need to remove the die from brush holder or PCB. And then rebond into a special package. If gel is not removed, the die cannot be rebond. Please make sure the die is totally gel removed. Otherwise, FA cannot do wire bond.
Gel remove recipe:
Can be: MOMENTIVE Silopren* Silicone Remover TP 3888
https://www.momentive.com/products/showtechnicaldatasheet.aspx?id=10807
DOE parameters:
- Soak time: 1-24h
- Temperature (60°)
- Chemical Product refresh (3cycle)
