I'm having issues with the IAP on the chip LPC1788. In actual testing, I have hundreds of devices and everyone has a LPC1788 MCU. in my bootloader program, Flash is programmed , and the compare operation return success, then jump to the application code. The vast majority of devices could be run normally, except several which become bricks. I can ensure the iap jump is correct. And now I encounter two strange issues,
1. when i adjust the bin size of the app, some failed cases ever could be successful. when the size is between in a certain range, the failed cases become bricks inevitably.
2. Timer interrupt happens when iap operate. I know the program should disable all the interrupt , but why the majority of devices succeed, only several fail when I don't disable interrupt ?
Hi Wang Yang,
Thank you for your interest in NXP Semiconductor products and for the opportunity to serve you.
1. when i adjust the bin size of the app, some failed cases ever could be successful. when the size is between in a certain range, the failed cases become bricks inevitably.
-- I was wondering if you can provide more detailed information, for instance, what you do to adjust the bin size of the app, and you mention that the chip will become 'brick' if jump operation fails, had you ever try to dig this issue or learn the more information.
2. Timer interrupt happens when iap operate. I know the program should disable all the interrupt , but why the majority of devices succeed, only several fail when I don't disable interrupt ?
-- Disable the interrupt is used to get rid of any interrupt interferes in IAP operation, please keep in mind.
Have a great day,
TIC
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