Chip scale package with no bumps

取消
显示结果 
显示  仅  | 搜索替代 
您的意思是: 

Chip scale package with no bumps

496 次查看
davidmichaeli
Contributor I

hello, is it possible to order a WLCSP packaged ic (for example the MK22FN512CBP12R) Without the solder bumps. I'm aware recalling and de balling is a possibility for larger pitched components but here the pitch is too small to handle.

Thanks, david

0 项奖励
1 回复

349 次查看
vicentegomez
NXP TechSupport
NXP TechSupport

Please check the package your way for Kinetis MCUs

Regards

Vicente Gomez

0 项奖励