Chip scale package with no bumps

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Chip scale package with no bumps

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davidmichaeli
Contributor I

hello, is it possible to order a WLCSP packaged ic (for example the MK22FN512CBP12R) Without the solder bumps. I'm aware recalling and de balling is a possibility for larger pitched components but here the pitch is too small to handle.

Thanks, david

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vicentegomez
NXP TechSupport
NXP TechSupport

Please check the package your way for Kinetis MCUs

Regards

Vicente Gomez

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