We have several S9KEAZ128AMLH components in an opened static control bag and are about to put them into a production run. The bag has been open for an unknown amount of time with ambient humidity of 60-80%.
Thanks a lot for your patience.
I hope you are well. Answering your first question, the concerns are that you can create bubbles into de component by not baking it before reflow, and your component can be damaged. Regarding your second question, it is highly recommended to bake it before hand soldering too, for the same reason of moisture inside the component.
Please let me know if you have more questions.