Because of the chip shortage we've recently switched our products from the 144LQFP package to the 121XBGA (MK66FN2M0VLQ18 to MK24FN1M0VDC12). We've noticed that, with the BGA package, the MCU currently sits at about 50-60* C package temperature while drawing the same amount of current as the previous one we've used. It's significantly hotter than the LQFT version we've used before.
Is this normal? Obviously, being a smaller package and the same thermal energy being dissipated, that could be an explanation, but we'd obviously like to check first.
Hoping you are doing well.
Effectively, as the 121XBGA is smaller than 144LQFP package, the same thermal energy to be dissipated in a smaller area is higher.
Please let me know if you have more questions.