Searching Freescale's site for "MCF5328CVM240J" gives a number of hits. This is the one you're looking for:
http://cache.freescale.com/files/shared/doc/pcn/PCN13959.htm?fsrch=1&sr=6
New versions of the BGA-packaged product lines and part numbers that are not affected by the ITC Order have been developed. These new versions employ a different package die-attach material in which the characteristic modulus has been substantially modified. These changes to the die-attach material are outlined in Table 1. The remaining bill of materials (BOM) will not change.
So maybe the parts aren't surviving your temperature profile during soldering, whereas the previous ones did. This is unlikely.
HOWEVER
They've also released a new mask set as detailed here:
http://cache.freescale.com/files/shared/doc/pcn/PCN14392.htm?fsrch=1&sr=3
It may be that the MCF5328CVM240 parts you are testing have the old mask set, and MCF5328CVM240J parts have the new mask set. Check the mask revision level.
The release and implementation of this new maskset is to fix the SDRAM jumping clock issue when executing flexbus accesses.
That corresponds to SECF149 in the Errata.
That shouldn't have changed the bus timing in any significant way. It is unlikely your hardware is relying on the previous strange timing.
How about giving more details than "but it's fail"?
HOW exactly does it fail? What is it doing?
Tom
