Seeking patch process instructions. chips are not easy to be tinned and can't work

[chengtianquan]

Dear NXP,

Our Car TPMS project uses NXP products, a total of 4 ICs，FXTH87EH11DT1 (tire pressure sensor, HQFN24 package), QN9020 / EY (Bluetooth LE, HVQFN48 package), QN9021 / EY (Bluetooth LE, HVQFN32 package), NCK2910AHN (RF receiver, HVQFN32 package).
For the packaging of related chips, our chip has encountered soldering problems, that is, poor solder contact of the chip. As a result, some chips cannot work, or only work for a period of time. We need to seek your support to improve our placement process.
For the four chip packages mentioned above, does NXP have a placement process description document?

Looking forward to your reply.

Thank you.

Best Regards

Owen

[vicentegomez]

We have some solder recommendations on the following documents,

https://www.nxp.com/docs/en/application-note/AN1902.pdf 

https://www.nxp.com/docs/en/nxp/application-notes/AN11996.pdf 

Also please check the solder profile and the solder paste that you are using.

Please let me know your comments of if you have more questions

Regards