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NXP amplifier, TDF8546TH / N2ZJ, seeking instructions for chip baking process

Question asked by 天泉 成 on Jan 3, 2020
Latest reply on Jan 5, 2020 by 天泉 成

Dear NXP,

 

TDF8546TH / N2ZJ, its humidity sensitivity is 3, chip thickness is 3.3mm. We need to perform the baking process before placement, but we don't know the specific operation steps, so we need to confirm. Such as how many hours after the tray is unpacked, the temperature of the chip baking, and the baking time.
Is there any relevant documentation, looking forward to your reply.
thank you!
Best Regards,
Owen

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