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NT2H1311G0DUF application circut and PCB foot print (Land pattern) for die bonding

Question asked by Lin Fiske on Sep 17, 2019
Latest reply on Sep 23, 2019 by Robin_Shen

We want to use NT2H1311G0DUF for NFC antenna Tag. The IC has four pin LA, LB, TP and GND. I know that the LA and LB are connected to antenna. Please tell me the circuit connection of TP and GND. Please send me the application circuit of this IC for NFC tag application. Besides, the IC is a die require die bonding on the PCB. Please send me the recommended PCB foot print (land pattern) of this IC for die bonding.