with reference to the title:
1) What is the coplanarity spec for this BGA?
2) Based on the datasheet for dimension A1, it is stated min 0.27, max 0.47mm. Hence need to confirm is there possibility to have both solder ball of smallest size (0.27mm) and biggest ball size (0.47mm) exist inside one BGA.
3) Does NXP supply in HARD TRAY packaging during shipment for MCF54450VM240?