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Pressure on i.MX8M BGA

Question asked by Davood Motlagh on Mar 14, 2019
Latest reply on Mar 20, 2019 by gusarambula
Branched to a new discussion

On i.MX8M chip, if a heat-sink is not used, but instead the chip is pressed on by the cast housing for heat transfer, what is the maximum pressure that can be applied on the chip before it becomes a concern for the BGA?  Does the existing eval board designed the spring loaded heat-sink with that pressure in mind?   Where will this force or the pressure can be found?

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