I'm working with P/N MPXM2202A which is a gold-leaded component, and IPC states that I should be pre-tinning this component before board installation in order to avoid gold embrittlement. According to your soldering recommendations document (AN3150), the suggested max temp for this part is 482 F (250 C), but my solder pot is only certified for 490 F.
Is the max temp spec referring to a max temp of the component body, or does it refer to the leads as well? Or to ask the question more basically, am I ok to dip the leads in my solder pot to tin them? If not, how would you recommend doing so?