In datasheet of PF8100, Table 6. QFN56 thermal resistance and package dissipation ratings, what is the meaning of (2S6P)? What is the environment test condition and setup of that thermal resistance and package dissipation rating test? Also how the test board implement? Other than PMIC, is there any other component on board. Our customer need details information on that and would you please help.
Thanks and Best Regards,